Reflow Soldering Ovens

Convection Reflow Soldering Ovens

Printed Circuit Board Reflow Soldering Ovens. Our new reflow oven offers enhanced efficiency and sustainability. With its low-height top shell, Industry 4.0 compatibility, and innovative flux management, it’s the ideal solution for high-throughput applications.


Voidless / Vacuum Reflow Soldering Ovens

Our vacuum reflow ovens, available in various sizes, deliver exceptional results with minimal voiding. Our IR-heated vacuum chambers provide precise temperature control for optimal soldering quality.


Formic/Fluxless Reflow Soldering Ovens

Heller has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases).


Pressure Curing Ovens

Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs…


Vertical Curing Ovens

With the largest installed base of US-made in-line vertical ovens in the world, Heller is the preferred choice of many leading electronics manufacturers. In-line, vertical automation of the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction.


Magazine Curing Ovens

Heller Industries is a leading provider of magazine curing ovens with a product line suitable for a wide range of applications. We offer both pressurized and non-pressurized magazine ovens in both batch-type and in-line formats.